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W25X16, W25X16A, W25X32, W25X64
14.6 16-Pin SOIC 300-mil (Winbond Package Code SF)
SYMBOL
MILLIMETERS
MIN MAX
INCHES
MIN MAX
A
A1
b
C
2.36
0.10
0.33
0.18
2.64
0.30
0.51
0.28
0.093
0.004
0.013
0.007
0.104
0.012
0.020
0.011
D
(3)
10.08
10.49
0.397
0.413
E
10.01
10.64
0.394
0.419
E1
(3)
7.39
7.59
0.291
0.299
e
(2)
1.27 BSC
0.050 BSC
L
0.39
1.27
0.015
0.050
θ
0
o
8
o
0
o
8 o
y
---
0.076
---
0.003
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
- 46 -
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